NEWS
sp3 Diamond Technologies Enhances Wafer Scale Diamond Capabilities; Names Dr. Mario M. Pelella VP of Engineering
SANTA CLARA, Calif. - April 16, 2013 - sp3 Diamond Technologies, Inc. announced today that it has established a new customer service department to better serve its customers. Under the direction of industry veteran Valerie Singer, the department is responsible for ensuring all customers receive the best possible CVD diamond products and services. Singer moves into the role of customer service manager effective April 8, 2013.
"sp3 created this new position within our organization to ensure that we consistently achieve the higest level of customer satisfaction," said Dwain Aidala, sp3 CEO. "Valerie's strong customer relationships and ongoing commitment to our customers make her an ideal candidate for this position. Under her leadership, we can continue to work towards exceeding customers' expectations by enhancing our communications and decreasing our responses times."
Singer is a 12-year veteran of the company, having joined sp3 in November of 2000. She will be responsible for coordinating all customer service requirements and sales orders. Please direct all customer inquiries to her attention at sp3's toll free number 877-773-9940 (x207) or via e-mail at vsinger@sp3inc.com.
sp3 Diamond Technologies, Inc.
sp3 Diamond Technologies is a global leader in polycrystalline CVD diamond products and services. The company's fundamental understanding of the unique properties of diamond allows it to bring to market a wide variety of CVD diamond technologies for an increasing number of applications. sp3 is also the leading manufacturer of hot filament CVD diamond reactors. Committed to expanding the commercial reach of CVD diamond, sp3 provides innovative, cost-effective CVD diamond products, solutions and services to its customers.
For more information about the company, please visit www.sp3diamondtech.com.
NEWS
sp3 Diamond Technologies Enhances Wafer Scale Diamond Capabilities; Names Dr. Mario M. Pelella VP of Engineering
SANTA CLARA, Calif. - November 13, 2012 - To support the growing adoption of diamond in electronics, sp3 Diamond Technologies, Inc. (sp3), a leading supplier of diamond products, deposition equipment and services, today announced the appointment of Mario M. Pelella, Ph.D., as vice president of engineering. In this role, he will lead the Technology and Process Solutions group, with responsibility for the development and technical success of all of sp3's semiconductor and MEMS-related diamond products and solutions. At the same time, the company announced that co-founder and chief technology officer (CTO) Jerry Zimmer has been named CTO Emeritus and will remain actively engaged with sp3.
"Diamond is truly entering the mainstream as a material that can solve a number of current bottlenecks in semiconductor and MEMS manufacturing, thereby improving device performance," said Dwain Aidala, president and CEO of sp3 Diamond Technologies. "In light of the rapidly increasing adoption of diamond, Mario's experience and ability to drive innovative technology solutions will strengthen sp3's ability to effectively address market requirements. His extensive experience in the semiconductor industry makes him an ideal fit for our organization."
Dr. Pelella brings a strong background in solid-state device physics, design and modeling, and characterization to sp3's multi-faceted engineering department. He is skilled in the fundamentals and of bulk-Si and silicon-on-insulator (SOI) MOS transistor and passive device technologies, high-voltage LDMOS design, bipolar device design, ESD protection and arcing and charging related yield issues.
Most recently, Dr. Pelella served as the director of technology solutions at SVTC Technologies where he was responsible for developing SVTC's technology roadmap for the semiconductor, aerospace and defense, MEMS, life science, photonic and energy industries. Prior to that, he held positions with tau-Metrix, Advanced Micro Devices (AMD) and IBM. Dr. Pelella earned his Ph.D. in Electrical Engineering from the University of Florida and BSEE and MSEE degrees from Clarkson University. He holds over 50 US patents and 15 worldwide patents and is the author of more than 60 publications, including three that earned Best Paper awards.
sp3 Diamond Technologies, Inc.
sp3 Diamond Technologies is a global leader in polycrystalline CVD diamond products and services. The company's fundamental understanding of the unique properties of diamond allows it to bring to market a wide variety of CVD diamond technologies for an increasing number of applications. sp3 is also the leading manufacturer of hot filament CVD diamond reactors. Committed to expanding the commercial reach of CVD diamond, sp3 provides innovative, cost-effective CVD diamond products, solutions and services to its customers.
For more information about the company, please visit www.sp3diamondtech.com.
NEWS
sp3 Diamond Technologies Awarded New Patents for Thermal Management in Semiconductor and Laser Applications
SANTA CLARA, Calif. - September 25, 2012 - sp3 Diamond Technologies, Inc. a leading supplier of diamond products, deposition equipment and services, today announced that it has been awarded two patents by the United States Patent and Trademark Office for its DiaMatch™ coefficient of thermal expansion (CTE) matched heat spreader technology. The diamond-based multilayered structure outlined in the patents solves several technical challenges to deliver the high heat spreading and CTE matching required for reliable semiconductor and laser packaging.
"In 2007, we received Phase II SBIR funding from the Missile Defense Agency to develop a thermal management solution that enables the next generation of high power lasers and semiconductors. We had established solid IP in this area and began providing solutions with great potential that target current and future high-power semiconductor and laser applications," stated Dwain Aidala, president and COO of sp3 Diamond Technologies. "We are currently in the process of identifying the right thermal management or specialized material partners to further develop this technology into a fully productized offering."
U.S. Patent Nos. 8,105,693 and 8,147,927 cover a multilayered structure including at least one diamond layer and methods of making these multilayered structures, respectively. The technology detailed in the patents is ideally suited for mounting large semiconductor chips such as high-power transistors and laser diodes where CTE matching is required.
The proliferation of diamond use in technology has seen a dramatic increase in recent years. Formed in 1993, sp3 Diamond Technologies has been a driving force in that commercialization.
"We experienced our best year ever in 2011 due in large part to two markets," continued Aidala. "We saw our diamond heat spreaders adopted in multiple applications, most notably in wireless base stations where the thermal properties of diamond are paying huge dividends. In CMP pad conditioning we sold five times more CVD diamond deposition tools than the previous year. Diamond is being adopted. While our CVD diamond equipment and our heat spreaders remain our primary focus, we see tremendous opportunity for diamond applications in the future. The potential for diamond layers in the SOI-based process alone creates fantastic growth opportunities."
About sp3's DiaMatch™ Multilayered CTE-Matched Diamond
Semiconductor devices require packaging with high thermal conductivity to prevent overheating and to maintain useful operation of the device. Existing materials generally deliver good thermal characteristics but poor CTE matching, or are well-matched to most semiconductor materials, but do not offer high enough thermal conductivity for today's devices. sp3's DiaMatch™ technology bridges this gap by offering variable CTE-matching, copper-level thermal conductivity, a choice of conductive or insulating die attach surfaces, precise edges and no compositional variability from point to point in the material.
The new patents detail a multilayered structure of thin diamond layers and high thermal conductivity metal layers and the methods of making the structure. The multilayered structure has a variable CTE, which depends on the various layer thicknesses and can be different on each side. This allows the structure to safely bond to common semiconductor materials such as silicon, silicon carbide, gallium arsenide, and gallium nitride while providing the thermal management benefits of diamond.
About sp3 Diamond Technologies, Inc.
sp3 Diamond Technologies provides CVD hot filament diamond deposition reactors and diamond-based solutions for electronics thermal management and enhanced cutting surfaces to companies worldwide, across a broad spectrum of industries. By supplying wafer-scale diamond-on-substrate products and services utilizing nano and microcrystalline diamond morphology, sp3 is expanding the commercial reach of polycrystalline CVD Diamond.
Founded in 1993 and headquartered in Santa Clara, California, USA, sp3 Diamond Technologies is a subsidiary of sp3 Inc., a privately owned, full service provider of products and services relating to thin film and freestanding diamond deposition and other diamond materials. sp3 Diamond Technologies provides diamond products for advanced thermal applications, diamond coating and material services, hot filament CVD reactors, and deposition consulting services.
